Solar wafer AOI and high-speed sorting equipment

Parameters

Dimension

10680*1600*2150mm

Weight

4630kg

Rated power

20kw

Electric power

AC380v/50hz

Air pressure

0.5~0.6mpa

Functions and Performance

Type

Solar monocrystalline /polysilicon wafers cut by diamond thread

Dimension

157*157~230*230mm

Thickness

80-240um

Defects

Warping, bending, edge chipping,
surface chipping, chamfer chipping,
soiling, holes, hidden cracks

Measurement item

Thickness, Wire Marks, Resistivity, TTV,
Roughness, Dimensions, PN Type

CT(182*182mm)= 0.25s/pcs,WPH≥16000

CT(210*210mm)= 0.3 s/pcs,WPH≥14000

Workflow

  • Dimension/fragmentation inspection
  • Hidden crack inspection
  • Left and right chipping inspection
  • Chamfering and chipping inspection
  • Upper dirt inspection
  • Sorting and discharging
  • Front and rear chipping inspection
  • PN type/resistivity test
  • Thickness / wire mark / roughness inspection
  • Lower dirt inspection
  • Sorting and discharging
  • Dimension/fragmentation inspection
  • Front and rear chipping inspection
  • Hidden crack inspection
  • PN type/resistivity test
  • Left and right chipping inspection
  • Thickness / wire mark / roughness inspection
  • Chamfering and chipping inspection
  • Lower dirt inspection
  • Upper dirt inspection

Advantages

  • Function and Performance Advantages

    Currently the industry's highest performance in terms of wafers per hour (WPH) is more than 16,000, which is much higher than the industry average of 10,000~12,000. Measurement accuracy reaches 0.8um, fragmentation rate is stable below 0.05%. Leakage rate < 0.1%. Overkill rate < 0.05%.

  • Electromechanical Advantages

    Feeding: two sets of cache mechanism seamlessly connects the feeding; compatible with multi-size flower baskets;Unloading: Bernoulli suspension type unloading device is adopted to ensure a very low fragmentation rate; parallel multiple independent unloading devices; seamless switching of unloading boxes.

  • Inspection Advantages

    Multi-station inspection of chipping and surface defects around the wafer, using a deep learning model that recognises the silicon material and completes the inspection with high accuracy.

  • Measurement Advantages

    Dual top and bottom line scanning cameras accurately identify thickness, flatness and line marks. Rejecting hidden cracks and fragments in advance of the inspection stage reduces the burden of subsequent downstream sorting.